GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

Chip design projects are notorious for generating huge amounts of design data. The design process calls for a dozen or more electronic design automation (EDA) software tools to be run in sequence.

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

How AI is driving chip design. How AI-powered EDA is being used in automation. Artificial intelligence is fueling innovation across industries, driving demand in the semiconductor industry for more ...

The AI revolution is driving change in how we design and manufacture everything from data centers to servers and chips. Even what we consider a chip is changing from the integration of analog circuits ...

Like other EDA vendors, Siemens EDA has over the past few years been adding artificial intelligence and machine learning capabilities to its suite of EDA (electronic design automation) tools. At the ...

Lee Jong-ho, Korea's Minister of Science and ICT, reportedly arranged a meeting with semiconductor Electronic Design Automation (EDA) professionals to gain insights into the local EDA industry. Lee, a ...

Taiwan's semiconductor IC designers are urging the government to introduce tax incentives for investments in expensive electronic design automation (EDA) and software tools, seeking relief from the ...

As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...